- Give a lot of consideration to component placement and orientation
- Avoid overlapping clock harmonics. Make harmonic table for each clock
- Clock signal loop area must be kept as small as possible. Get paranoid about clocks.
- Use multilayer boards with power and ground planes whenever possible.
- All high frequency signal traces must be on layers adjacent to a plane
- Keep signal layers as close to the adjacent plane layer as possible (<10 mils)
- Above 25MHz PCBs should have two or more ground planes
- When power and ground planes are on adjacent layers, the power plane should be recessed from the edge of the ground plane by a distance equal to 20 times the spacing between the planes
- Bury clock signals between power and ground planes whenever possible.
- Avoid slot in ground plane. Also applies to power plane.
- If a segmented power plane is necessary, signal traces must not be routed over the slots.
- Filter (series terminate) the output of clock drivers to slow down their rise/fall times and to reduce ringing typically 33 to 70 ohms
- Place the clock & high speed circuitry as far away from I/O area as possible.
- Use a minimum of two equal values decoupling capacitor on DIP packages, four on square packages. On high frequency/ high power/noisy IC many more capacitors may be necessary
- Consider using embedded capacitance PCB structure for decoupling on h-f boards (>50 MHz)
- Use impedance-controlled PCB layout technique with proper terminations where necessary
- On impedance-controlled PCB, do not transitions the signal from one layer to another unless both layers are referenced to the same plane
- On non-impedance-controlled PCBs, when a clock transitions from one layer to another & the layers are referenced to different planes add a transfer via or capacitor between the planes
- All traces whose length (in inches) is equal to or greater than the signal rise/fall time (in nanoseconds) must have provision for a series-termination resistor (typically 33 ohms)
- Simulate all nets whose length (in inches) is equal to or greater than the signal rise/fall time (in ns)
- Connect logic ground to the chassis (with a very low Z connection) in the I/O area. This is crucial!
- Provide for an additional ground to chassis connection at the clock/oscillator location.
- Additional ground to chassis connection may also be required
- Daughter boards (with h-f, noisy devices and/or external cables) must be properly grounded to the motherboard and/or chassis (do not rely the ground pin s in the connector to provide this ground)
- Provide C-M filters on all I/O lines. Group all I/O lines together in a designated I/O area of PCB
- Shunt capacitors used in I/O filters must have a very low impedance connection to chassis.
- Use a power entry filter on the dc power line (both C-M and D-M)
- Most products in plastic enclosures need to be provided with an additional metal reference plane
- Consider the use of board level component shields where applicable
- Ground all heat sinks
