The encroached via concept is one that uses soldermask on the bottom via pad without filling the via’s plated-through hole. Encroachment-type vias have the top-side soldermask open and the bottom-side soldermask opening adjusted, so that it is slightly larger than the via hole size (typically +0.06 mm).
If the mask is opened all the way around an EPAD via (OPEN via), then solder can flow out from under the QFN EPAD onto the bottom-side via pad as a big drop. This drop often drips off during the motion of the unit through the reflow oven, pulling solder from the EPAD joint. This solder “scavenging” can render the EPAD connection unreliable and/or cause the device to tilt, resulting in unreliable pin connections.
Encroached via can be created in Altium Design by defining Solder Mask Expansion setting with negative values as below. For best result, via with and Finished hole size, FHS of 0.25 to 0.3mm and bottom-side soldermask opening of 0.055 mm to 0.075mm larger than the FHS.
