For traces that don't need specific impedance or high current, a 10 mil trace width is fine for the vast majority of low-current analog and digital signals. Printed circuit board traces that carry more than 0.3 A may need to be wider.
Route the signal in a daisy chain.
Do not route the signal over split planes
Avoid plane obstruction (slot) whenever possible. If routing over them is unavoidable, use stitching capacitors.
Add dedicated ground vias close to the source and sink of the signal.
Do not use right-angle traces.
Transition vias to pads, notably between thin and thick traces on the output pins. The teardrop approach reduces thermal stress during the signal transition. This procedure prevents traces from cracking and increases their mechanical strength.
Route traces in parallel pairs when routing around an object to avoid differential impedance and discontinuities caused by split traces
Place passive components within the signal path, such as source-matching resistors or ac-coupling capacitors, and next to each other. Placing components in parallel creates wider traces spacing. Staggering components is not recommended as it creates narrow areas.
Avoid the route entry to pad which could cause component shiftting during reflow due to solder pull.
